Multilayer Fabrication

Multilayer chip with exploded view

Most microfluidic chips are made out of several layers, which are somehow bonded together. Typically, one uses two or three layers.

At Translume we have fabricated chips with up nine layers.  We fused these layers together using a thermal bonding process

Using Layers to Simplify your Design

For devices that include many functionalities, using multiple layers often simplify the design and the prototyping, possibly lowering the overall fabrication costs.

For example the device shown is made with 7 layers:

- The three central layers (colored in brown in the exploded view schematic drawing) contain various integrated optical elements, including an optical fiber port. 

- The two outside layers (colored in blue) are designed to facilitate the centering of the two Luer connectors and a photodetector (in green on the right).

- The other two layers (colored in grey) provide some microfluidic functionalities.

During the thermal bonding, air pockets can be permanently trapped between the various layers. To minimize this effect, each glass layer includes some air vents (not shown in these models). This practice reduces the size of the trapped air bubbles, but does not completely eliminate them.

After the thermal bonding, the seven layers form a strong monolith. The Luers, fiber, and photodetectors are added after completion of the thermal bonding.

 

 

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